GRENOBLE, France, July 30 (Bernama-GLOBE NEWSWIRE) — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces Hydra3D™, its new Time-of-Flight (ToF) CMOS image sensor, tailored for 3D detection and distance measurement. The sensor supports the latest industrial applications, including vision guided robotics, logistics and automated guided vehicles. Hydra3D’s high resolution and flexible configuration, combined with its on-chip HDR, make it ideal for outdoor applications such as surveillance, ITS, building construction and drones.
The sensor features a 10 µm three-tap cutting-edge pixel, designed with Teledyne e2v’s proprietary CMOS technology and produced by Tower Semiconductor, the leader in high-value analog semiconductor foundry solutions. Incorporating a resolution of 832 x 600 pixels, Hydra3D provides very fast transfer times starting from 20ns, excellent demodulation contrast and sensitivity. The sensor can be operated in real-time at short, mid and long-range distances, in both indoor and outdoor conditions, while providing excellent temporal precision.
