HSINCHU, Taiwan / PENANG, Malaysia, Feb 9 (Bernama) — Chipbond Technology Corporation, a leading global provider of semiconductor packaging and testing services, today marked the official opening of its new advanced manufacturing facility, Chipbond Technology Malaysia Sdn. Bhd., located in Valdor Industrial Park, Batu Kawan, Penang, Malaysia.
The establishment of the facility represents a significant milestone in Chipbond’s global expansion strategy, with a total investment of close to US$200 million (approximately RM800 million). The new plant strengthens Malaysia’s position within the global outsourced semiconductor assembly and test (OSAT) value chain, while reinforcing Malaysia’s role as a key hub for advanced semiconductor manufacturing.