BOCA RATON, Fla., Aug 28 (Bernama-BUSINESS WIRE) — Boyd, whose chip-to-ambient liquid cooling technologies make it easier for data center owners and operators to implement new AI infrastructure, announced it launched a new thermal testing tool to help end clients more safely and efficiently deploy liquid cooled data centers and improve time to market.
Boyd’s Rack Emulator simulates the pressure drop and heat dissipation of a rack and uses automation to test coolant distribution units (CDUs) and facility cooling systems to validate thermal performance before connecting to data center IT equipment, ensuring efficient and safe operation through start up without damage. The Rack Emulator is programmable and flexible to simulate any rack. Connect to the liquid cooling system and input capacity and pressure drop protocols, and Boyd’s Rack Emulator operates like a rack, simulating rack operating characteristics. The Rack Emulator can additionally test electrical inputs to the rack before the server is put in place. It is easy to operate without specialized training, making it easy to deploy at scale in data centers. Functioning as a thermal load bank and simulator packaged in a rack size, the Rack Emulator conveniently fits within a data center row minimizing the space required to do load bank testing and simplifying simulations. It is easy to ship, store, and handle, contributing to overall lower total cost of ownership. Boyd’s Rack Emulator is available to order now and will start shipping in September.
