SPIL Breaks Ground On New RM6-Billion Semiconductor Packaging And Testing Facility

PULAU PINANG, Malaysia, May 24 (Bernama) — Siliconware Precision Industries Co., Ltd. (SPIL), a major global semiconductor packaging and testing company, celebrated a significant milestone today with the ground-breaking ceremony of its Malaysia P1 plant at Bandar Cassia Technology Park, Pulau Pinang. This state-of-the-art 8-hectare facility represents a substantial investment of RM6 billion. Over the next 15 years, the plant is projected to create nearly 3,000 skilled jobs, introduce advanced packaging and testing technologies such as wafer bumping, and offer comprehensive turnkey solution (including wafer bumping, wafer-level chip packaging, flip chip packaging and testing). This initiative is expected to significantly reduce production cycles, enhancing efficiency and competitiveness in the semiconductor industry. 



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