WATERLOO, Ontario, June 8 (Bernama-GLOBE NEWSWIRE) — Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to announce its Linea™ HS 16k Backside Illuminated (BSI) TDI camera is in production now. With its CLHS interface, this camera offers enhanced sensitivity and is ideal for Near Ultraviolet (NUV) and visible imaging applications such as wafer, flat panel display and electronic packaging inspection as well as photoluminescence and life science imaging.
The new Linea HS 16k BSI uses Teledyne DALSA’s charge-domain CMOS TDI 16k sensor with a 5×5 μm pixel size and delivers a maximum line rate of 400 kHz aggregate. Compared with Front Side Illumination (FSI), the BSI model significantly improves quantum efficiency in the near ultraviolet and visible wavelengths and boosts signal-to-noise ratio for imaging applications in light starved conditions.
