KUALA LUMPUR, May 11 (Bernama) — Indium Corporation, a US-based global materials supplier to the electronics assembly and semiconductor packaging industries, announced its investment of RM250 million (USD57 million; BNM exchange rate USD1 = MYR 4.3845) today for its expansion in Malaysia with its new manufacturing facility for its advanced solder paste and engineered solder products set to be constructed in Penang.
The new Penang-based facility, which spans 37,500 square feet will manufacture finished products such as solder pastes, fluxes, and preforms. The facility is anticipated to commence operation in two (2) phases, with solder paste manufacturing by the end of 2022 and engineered materials manufacturing in 2023. The project is also anticipated to create 88 high-value new jobs.