TOKYO, Oct 28 (Bernama-BUSINESS WIRE) — Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames that fix semiconductor chips and connects them externally. In addition, the new technology improves adhesiveness with a surface roughening technology of the highest industry standard that seals the copper surface to the mold compound.
By providing this high definition, highly reliable lead frame we aim to expand the use of semiconductor Quad Flat Non-leaded package (QFN) for vehicles.
