TOKYO, Feb 27 (Bernama) — Toshiba Memory Corporation, the world leader in memory solutions, today announced that it would begin sampling new JEDEC e-MMC Ver. 5.1[1] compliant embedded flash memory products utilizing BiCS FLASH™ 3D flash memory for consumer applications in the end of March.
e-MMC products are embedded flash memory products integrating flash memory chips and a controller in a single package.
The company will continue to reinforce its market-leading position by adding BiCS FLASH™ 3D memory embedded products to its lineup of flash memory products.
